Airstrip Whitepaper

Mechanical packaging plays a significant role in achieving higher levels of integration at the system level. By incorporating multiple component functions within a single housing, opportunities for impedance mismatches and losses between discrete connectorized components can be eliminated. In addition, combining several components into an integrated package can reduce size, weight, and interconnecting cables. To achieve such packaging benefits, however, requires not only optimized RF/ MW performance relative to topology, but also thoughtful mechanical integration as part of the entire design process.